出願現況
韓国知的財産庁公認の弁理士による特許・商標のオンライン出願サービス、発行・登録サービスを提供しています。
特許・商標現況
以下のKIPOが提供するリストを参照してください。
Patents/Utility ModelsTrademarks
Total 102 Articles (1 / 11 Pages)
| Registered GALLIUM NITRIDE SEMICONDUCTOR STRUCTURE ON DIAMOND SUBSTRATE WITH IMPROVED RELIABILITY AND PROCESS FOR FABRICATING THEREOF(신뢰성을 개선한 다이아몬드 기판 상 질화 갈륨 반도체 구조체 및 이를 제조하는 공정) | ||
 | IPC: H01L 21/02 C30B 29/38 .... App. No.: 1020200049546 Reg. No.: 1022733050000 Pub. No.: Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20200423 Reg. Date: 20210630 Pub. Date: Inventor(s): LEE, Tae Kyoung |
| Unexamined SEMICONDUCTOR DEVICES INCLUDING MULTIPLE POWER COMBINING AMPLIFIERS HAVING SELECTABLE INPUT-OUTPUT PORTS(선택 가능한 입출력 포트를 구비한 복수개의 전력 결합 증폭기를 포함하는 반도체 소자) | ||
 | IPC: H01L 29/778 H01L 29/66 .... App. No.: 1020220152187 Reg. No.: Pub. No.: 1020240070819 Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20221115 Reg. Date: Pub. Date: 20240522 Inventor(s): KIM, Chang-Min |
| Registered STRUCTURE FOR GENERATING HIGH POWER MICROWAVE SIGNALS(고출력 마이크로파 신호 생성 구조체) | ||
 | IPC: H01P 5/107 H03F 3/60 App. No.: 1020210115397 Reg. No.: 1026710240000 Pub. No.: 1020210135945 Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20210831 Reg. Date: 20240527 Pub. Date: 20211116 Inventor(s): KWON, Young Man... |
| Registered BROADBAND RADIO FREQUENCY SEMICONDUCTOR PACKAGE(광대역 RF 반도체 패키지) | ||
 | IPC: H01L 23/66 H01L 23/04 .... App. No.: 1020200102847 Reg. No.: 1021618540000 Pub. No.: Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20200815 Reg. Date: 20200924 Pub. Date: Inventor(s): OH, Seongmin... |
| Registered FABRICATION PROCESS OF DIAMOND SUBSTRATE, DIAMOND COVER, DIAMOND PLATE AND SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE USING THE SAME(다이아몬드 기판, 다이아몬드 커버, 다이아몬드 플레이트 및 반도체 패키지의 제조 공정, 및 이를 이용하여 제조된 반도체 패키지) | ||
 | IPC: C30B 25/16 C30B 25/10 .... App. No.: 1020200184855 Reg. No.: 1025289900000 Pub. No.: 1020220093788 Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20201228 Reg. Date: 20230428 Pub. Date: 20220705 Inventor(s): LEE, Taekyoung... |
| Registered GALLIUM NITRIDE SEMICONDUCTOR STRUCTURE ON DIAMOND SUBSTRATE AND PROCESS FOR FABRICATING THEREOF(다이아몬드 기판 상 질화 갈륨 반도체 구조체 및 이를 제조하는 공정) | ||
 | IPC: H01L 21/02 C30B 29/40 App. No.: 1020190179215 Reg. No.: 1022206480000 Pub. No.: Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20191231 Reg. Date: 20210222 Pub. Date: Inventor(s): LEE, Tae Kyoung... |
| Registered APPARATUS FOR HEATING FLUID USING MICROWAVE FOR SYNTHESIS OF COMPOUNDS(화합물의 합성을 위한 마이크로파 가열 장치) | ||
 | IPC: H05B 6/80 H05B 6/70 .... App. No.: 1020200146414 Reg. No.: 1023482600000 Pub. No.: Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20201104 Reg. Date: 20220104 Pub. Date: Inventor(s): KIM, Cheol Jun |
| Registered GALLIUM NITRIDE-BASED HIGH POWER TRANSISTOR STRUCTURE FOR HEAT DIFFUSION AND IMPEDANCE MATCHING THEREOF AND METHOD FOR FABRICATING THE SAME(열 확산 및 임피던스 정합을 위한 GaN 기반 고출력 트랜지스터 구조체 및 이를 제조하는 방법) | ||
 | IPC: H01L 23/367 H01L 23/64 .... App. No.: 1020200050624 Reg. No.: 1022732990000 Pub. No.: Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20200427 Reg. Date: 20210630 Pub. Date: Inventor(s): CHO, Sam Yul |
| Registered A HIGH FREQUENCY SEMICONDUCTOR DEVICE PACKAGE AND A FABRICATING METHOD THEREOF(고주파 반도체 소자 패키지 및 그 제조 방법) | ||
 | IPC: H01L 23/28 H01L 23/367 .... App. No.: 1020200052518 Reg. No.: 1023960960000 Pub. No.: 1020210133648 Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20200429 Reg. Date: 20220504 Pub. Date: 20211108 Inventor(s): CHOI, Myueng Seok |
| Registered GALLIUM NITRIDE-BASED SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THEREOF(GaN 기반 반도체 패키지 및 이를 제조하는 방법) | ||
 | IPC: H01L 23/15 H01L 23/50 .... App. No.: 1020190175158 Reg. No.: 1023046130000 Pub. No.: 1020210082826 Agent: KANG JUYEONG | Applicant(s): RFHIC CORPORATION Filing Date: 20191226 Reg. Date: 20210915 Pub. Date: 20210706 Inventor(s): LEE, Tae Kyoung... |
Total 58 Articles (6 / 6 Pages)
| Registered GREETING | ||
 | Classes: 35 App. No.: 4020210115846 Reg. No.: 4019474300000 Pub. No.: 4020220117753 Agent: 20220916 Vienna Code(s): | Applicant(s): Doodlin Corp. Filing Date: 20210604 Reg. Date: 20221213 Pub. Date: 20220916 |
| Registered 리본택시 | ||
 | Classes: 39 App. No.: 4020210071407 Reg. No.: 4019280980000 Pub. No.: 4020220096580 Agent: 20220808 Vienna Code(s): | Applicant(s): Kornatus. Co., Ltd. Filing Date: 20210407 Reg. Date: 20221031 Pub. Date: 20220808 |
| Registered 눈바디 | ||
 | Classes: 44 App. No.: 4020200180678 Reg. No.: 4018510260000 Pub. No.: 4020220004924 Agent: 20220112 Vienna Code(s): | Applicant(s): Team Elysium Inc. Filing Date: 20201014 Reg. Date: 20220331 Pub. Date: 20220112 |
| Registered 데피엘비 Defi LB | ||
 | Classes: 35 App. No.: 4020200236298 Reg. No.: 4018808680000 Pub. No.: 4020220028676 Agent: 20220308 Vienna Code(s): 260323 260412 .... | Applicant(s): LEE, Sumin Filing Date: 20201223 Reg. Date: 20220621 Pub. Date: 20220308 |
| Rejected Untitled | ||
 | Classes: 21 App. No.: 4020200141574 Reg. No.: Pub. No.: Agent: Vienna Code(s): 090107 190301 .... | Applicant(s): Miller Methods (Pty) Ltd Filing Date: 20200812 Reg. Date: Pub. Date: |
| Registered REDTOP | ||
 | Classes: 21 App. No.: 4020200141572 Reg. No.: 4018104250000 Pub. No.: 4020210104094 Agent: 20210812 Vienna Code(s): | Applicant(s): Miller Methods (Pty) Ltd Filing Date: 20200812 Reg. Date: 20211214 Pub. Date: 20210812 |
| Registered REDTOP | ||
 | Classes: 21 App. No.: 4020200141573 Reg. No.: 4018104260000 Pub. No.: 4020210104095 Agent: 20210812 Vienna Code(s): 010302 260201 .... | Applicant(s): Miller Methods (Pty) Ltd Filing Date: 20200812 Reg. Date: 20211214 Pub. Date: 20210812 |
| Registered 반반택시 | ||
 | Classes: 39 App. No.: 4020200070044 Reg. No.: 4017217540000 Pub. No.: 4020210009220 Agent: 20210121 Vienna Code(s): | Applicant(s): Kornatus. Co., Ltd. Filing Date: 20200427 Reg. Date: 20210430 Pub. Date: 20210121 |